Yunlong Li received the M.Sc. degree in engineering from Tsinghua University, Beijing, China, in 2002, and the Ph.D. degree in electrical engineering from the University of Leuven, Leuven, Belgium, in 2007. He is currently a Senior R&D Engineer with imec, Leuven. His current research and development work focuses on the CMOS-FAB compatible integration process exploration for novel image sensors by using thin film, III–V, and 3-D stacking/assembly technologies. He has authored or coauthored more than 90 papers in peer-reviewed journals and conferences on material, process, integration exploration, and reliability in CMOS back end of line (BEOL), 3-D integrated circuit packaging technology, and infrared image sensor technology.