Yasuhiro Yokoyama

Yoshihiko Yokoyama was born in Shizuoka prefecture, Japan in 1975. He received the B.S. and M.S. degrees in mechanical engineering from Ritsumeikan University, Kyoto, Japan, in 1999 and 2001, respectively. He joined the Seiko Epson Corporation, Nagano prefecture, Japan, in 2001. Since 2004, he has been with the Advanced Technology Development Department of Seiko Epson. His research interests include silicon dry etching processes, Cu filling processes, and flip-chip bonding technology for 3-D packaging.