基本信息
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职业迁徙
个人简介
Koichi Takemura (Member, IEEE) received the B.E. and M.E. degrees in metal science and technology from Kyoto University, Kyoto, Japan, in 1986 and 1988, respectively, and the D.E. degree in electronics and applied physics from the Tokyo Institute of Technology, Yokohama, Japan, in 2017. In 1988, he joined NEC Corporation, Kawasaki, Japan, and engaged in the research and development of high-dielectric-constant and ferroelectric thin-film capacitors for Gbit DRAMs, FeRAMs, and GaAs MMICs, and passive-embedded Si interposers for 3D system integration. From 1998 to 1999, he was a Visiting Researcher with Pennsylvania State University, State College, PA, USA. He was with the Association of Super-Advanced Electronics Technologies (ASET) from 2008 to 2010 and the Photonics Electronics Technology Research Association (PETRA) from 2012 to 2021. He is currently a General Manager (optical packaging) with AIO Core Co., Ltd., Tokyo, Japan. Dr. Takemura is a Member of IEEE Electronics Packaging Society, Japan Institute of Electronics Packaging, and Japan Society of Applied Physics.
研究兴趣
论文共 34 篇作者统计合作学者相似作者
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Shuhei Sudo, Osamu Hirata, Kazuhiro Shiba, Michiyo Kubo,Shigeru Kobayashi,Keizo Kinoshita,Takahiro Nakamura,Koichi Takemura,Kazuhiko Kurata
2024 International Conference on Electronics Packaging (ICEP)pp.257-258, (2024)
Akihiro Noriki,Akio Ukita,Koichi Takemura, Satoshi Suda, Takayuki Kurosu,Yasuhiro Ibusuki, Isao Tamai,Daisuke Shimura,Yosuke Onawa,Hiroki Yaegashi,Takeru Amano
Erekutoronikusu Jissō Gakkaishi/Erekutoronikusu Jissou Gakkaishino. 5 (2022): 418-423
Transactions of the Japan Institute of Electronics Packagingno. 0 (2022): E21-13
OPTICAL INTERCONNECTS XXII (2022)
Conference on Lasers and Electro-Opticspp.1-2, (2022)
Journal of The Japan Institute of Electronics Packagingno. 2 (2022): 162-165
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作者统计
#Papers: 34
#Citation: 329
H-Index: 9
G-Index: 18
Sociability: 4
Diversity: 2
Activity: 6
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