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论文共 88 篇作者统计合作学者相似作者
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Sehyeon Cho, Dayoung Kong, Gyohoon Geum, Seungjae Lee, Junrae Park,Seong Hyuk Lee,Jungho Lee,Hyoungsoon Lee
INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER (2024)
ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2024)
ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2024)
Andoniaina M. Randriambololona, Vivek Manepalli, Rachel C. McAfee, Bidisha Ojha, Rahi Miraftab-Salo,Kidus Guye,Hyoungsoon Lee,Samuel Graham,Damena Agonafer
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-8, (2024)
Byungwook Kim,Thanh Dam Mai,Duy-Tan Vo, Hyeon Kyun Lee, Yoonhyeong Jeong,Sungho Chang,Hyoungsoon Lee,Jaiyoung Ryu
INTERNATIONAL JOURNAL OF ENGINE RESEARCHno. 3 (2024): 513-526
ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2024)
INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER (2024)
Journal of Mechanical Science and Technologyno. 4 (2024): 2143-2150
Heungdong Kwon,Qianying Wu,Daeyoung Kong,Sougata Hazra, Katherine Jiang, Chulmin Ahn,Sreekant Narumanchi,Hyoungsoon Lee,James Palko,Ercan M. Dede,Mehdi Asheghi,Kenneth E. Goodson
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-10, (2024)
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作者统计
#Papers: 88
#Citation: 1227
H-Index: 22
G-Index: 33
Sociability: 5
Diversity: 2
Activity: 76
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