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A SiCOHBEOL interconnect technology for high density and high performance 65 nm CMOS applications
M Angyal,J Gill,M Inohara, MF Ng,SH Rhee,S Lane, H Hichri,C Penny,I Melville,V Ramachandran,BC Zhang,YK Siew,F Zhang,KC Park, KW Lee,E Kaltalioglu,SO Kim,G Matusiewicz,YH Lin, K Urata,K Kumar, J Linville,M Minami, H Maynard,M Hoinkis,T Bolom, F Feustel, KS Lam,K Inoue,A Simon, J Smith, B Baker-O'Neal,L Economikos, P Ong, Y Ishikawa, M Naujok,A Sakamoto, T Ema, G Lembach, M Kelling, T Bailey, S Marrokey,WK Li,C Christiansen,BZ Li,T Lee, F Chen, K Chanda,R Filippi, PV McLaughlin,J Demarest,D Dunn,P Flaitz,B Rhoads, C Manya, A Calabrese,P Roper, K Petrarca,W Cote,D McHerron,A Cowley,T Ivers
Advanced Metallization Conference 2005 (AMC 2005)pp.39-46, (2006)
引用0浏览0引用
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A 90nm dual damascene hybrid (organic/inorganic) low-k - Copper BEOL integration scheme
TJ Dalton,A Cowley,L Clevenger,D LaTulipe,WK Li,K Kumar,A Simon,S Kaldor,CC Yang,YH Lin,M Hoinkis, T Schact, M Naujok,L Economikos,N Rovedo, A Olbrecht, H Wang,A Swift,B Li, K Chanda,T Lee, L Burrel,G Matusiewicz, F Fayaz, S Yang, T Yanagisawa, N Lu,M Angyal,D Dunn, H Ng,C Wann,S Crowder, TC Chen
ADVANCED METALLIZATION CONFERENCE 2003 (AMC 2003)pp.85-89, (2004)
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Integrated Electro-Chemical Mechanical Planarization (ecmp) for Future Generation Device Technology
L Economikos, X Wang, A Sakamoto, P Ong,M Naujok, R Knarr, L Chen,Y Moon,S Neo, J Salfelder,A Duboust,A Manens, W Lu,S Shrauti, F Liu,S Tsai, W Swart
crossref（2004）
引用39浏览0EIWOS引用
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作者统计

#Papers: 8

#Citation: 92

H-Index: 4

G-Index: 5

Sociability: 5

Diversity: 1

Activity: 0

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