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Table-Top Evaluation Approach to Design Post-CMP Clean Chemicals
Tomohiro Kusano,Kan Takeshita
Meeting abstracts/Meeting abstracts (Electrochemical Society CD-ROM)no. 17 (2019): 1038-1038
引用0浏览0引用
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Post CMP Cleaning Technology for Advanced Semiconductor Devices
Yasuhiro KAWASE,Tomohiro KUSANO,Ken HARADA,Kan TAKESHITA
Seimitsu Kōgakkaishi/Seimitsu Kougakkaishino. 3 (2018): 230-234
引用0浏览0引用
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Corrosion inhibition of Cobalt during post-Chemical Mechanical Planarization Cleaning
Toshiaki Shibata,Tomohiro Kusano,Ken Harada,Kan Takeshita,Yasuhiro Kawase
ICPT 2017; International Conference on Planarization/CMP Technologypp.1-4, (2017)
引用1浏览0EIWOS引用
1
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Pre-applied Inter Chip Fill Material for 3D Chip Stack Integration – How to Improve Bonding Quality and Reliability
Kan Takeshita,Makoto Ikemoto,Masaya Sugiyama, Hidehiro Yamamoto,Hideki Kiritani, Jun-Wei Shen, Tetsuharu Yuge, Hiroya Kodama,Yasuhiro Kawase
International Symposium on Microelectronicsno. 1 (2016): 000333-000337
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Development and Usability Study of Pre-Applied Inter Chip Fill for 3D-IC
Kan Takeshita,Makoto Ikemoto,Masaya Sugiyama, Hidehiro Yamamoto,Hideki Kiritani, Yashuhiro Kawase
Proceedings of the International Symposium on Microelectronicsno. 1 (2015): 000589-000593
引用1浏览0引用
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作者统计

#Papers: 7

#Citation: 3

H-Index: 1

G-Index: 1

Sociability: 3

Diversity: 0

Activity: 0

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