Binbin Jiao

Binbin Jiao (Member, IEEE) received the B.S. degree from Xi’an Jiaotong University, Xi’an, China, in 2003, and the Ph.D. degree in microelectronics and solid-state electronics from the Institute of Microelectronics, Chinese Academy of Sciences, Beijing, China, in 2008. His main research interests include wafer level bonding technology, MEMS devices and systems, CMOS-MEMS process development, and microchannel cooling for chips.