Huijun He - Metal Powder Materials Industrial Technology Research Institute of CHINA GRINM

2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)pp.1-5, (2023)

引用0浏览0EIWOS引用

Progress of Interconnect Materials in the Third-generation Semiconductor and Their Low-temperature Sintering of Copper Nanoparticles

Xin Ke,Xie Bingqing,Zhong Wang,Zhang Jingguo,Wang Jianwei,Li Zhanrong,He Huijun,Wang Limin

Journal of Inorganic Materialspp.345-345, (2023)

引用0浏览0引用

The Facile Three-Dimensional Printing of the Composite of Copper Nanosized Powder and Micron Powder with Enhanced Properties

Youzhi Zhou,Huijun He,Jingjie Xu,Minghui Liang,Limin Wang,Ligen Wang,Xu Pan,Qiang Hu,Jingguo Zhang

3D PRINTING AND ADDITIVE MANUFACTURING（2023）

引用0浏览0WOS引用

Study on the Resistivity and Porosity of Nano Copper Powder Under Low-Temperature Sintering without Pressure

Xin Ke,Bingqing Xie,Chaohui Zhao,Jianwei Wang,Jingguo Zhang,Liqing Ban, Weiying Li,Qiang Hu,Huijun He,Limin Wang,Zhong Wang

2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)pp.139-143, (2023)

引用0浏览0EIWOS引用

Effects of Alloying Elements on the Interfacial Segregation of Bismuth in Tin-Based Solders

Jiasi Yan,Wei Xiao,Jianwei Wang,FuWen Zhang,Xiaowu Li,Huijun He,Ligen Wang

Social Science Research Network（2022）

引用2浏览0引用

加载更多

作者统计

合作学者

合作机构

D-Core

合作者
学生
导师

暂无相似学者，你可以通过学者研究领域进行搜索筛选

数据免责声明

页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果，我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问，可以通过电子邮件方式联系我们：report@aminer.cn