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个人简介
FréDéric Gianesello (Member, IEEE) received the B.S. and M.S. degrees in electronics engineering from the Institut National Polytechnique de Grenoble, Grenoble, France, in 2003, and the Ph.D. degree in electrical engineering from Joseph Fourier University, Grenoble, in 2006.
He is currently with STMicroelecetronics, Crolles, France, where he leads the team responsible for the development of electromagnetic devices (inductor, balun, transmission line, and antenna) integrated on advanced radio frequency CMOS/BiMOS (down to 14 nm), silicon photonics, and advanced packaging technologies (3-D integration and FOWLP). He has authored or coauthored over 110 refereed journal articles and conference technical papers.
Dr. Gianesello has served on the TPC for the International SOI Conference from 2009 to 2011. He is serving on the TPC for the Loughborough Antennas and Propagation Conference (LAPC).
研究兴趣
论文共 185 篇作者统计合作学者相似作者
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Jean-Marc Boucaud,Cedric Durand,Frederic Gianesello,Davide Bucci, Jean-Emmanuel Broquin,Emmanuel Dubois
Applied Physics Lettersno. 5 (2024)
2023 53RD EUROPEAN MICROWAVE CONFERENCE, EUMCpp.6-9, (2023)
SSRN Electronic Journal (2023)
Lucas Antunes Tambara,Pascal Masson,Julien Amouroux,Stéphane Monfray,Julien Dura,Frederic Gianesello, Julien Babic,Romain Debroucke,Loic Welter,Siddhartha Dhar, Bernadette Gros,Clement Charbuillet,Franck Julien,Guillaume Bertrand,Arnaud Régnier,Alain Fleury
IEEE International Conference on Design, Test and Technology of Integrated Systemspp.1-4, (2023)
Siddhartha Dhar,Stephane Monfray,Frederic Gianesello,Franck Julien,Julien Dura,Charles-Alex Legrand,Julien Amouroux, Bernadette Gros,Loic Welter,Clement Charbuillet,Philippe Cathelin, Elodie Canderle,Nathalie Vulliet, Emmanuel Escolier, Lucas Antunes, Eric Rouchouze,Pascal Fornara,Christian Rivero,Guillaume Bertrand,Pascal Chevalier,Arnaud Regnier,Daniel Gloria,Alain Fleury
2023 IEEE 23RD TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMSpp.38-40, (2023)
Ismael Charlet,Bruno Reig, Corentin Mercier,Julien Delprato,Vincent Puyal, Clemence Hellion, Marjolaine Allain,Stephane Monfray,Alain Fleury,Frederic Gianesello,Philippe Cathelin,Jean-Francois Robillard,Emmanuel Dubois,Jose Lugo-Alvarez
2023 18TH EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE, EUMICpp.177-180, (2023)
J. Patouillard,R. Gassilloud,F. Mercier,A. Mantoux,R. Boichot,A. Crisci, M. Bernard,N. Gauthier,S. Cadot, C. Raynaud,F. Gianesello,E. Blanquet
Journal of vacuum science & technology A Vacuum, surfaces, and filmsno. 5 (2023)
IEEE Transactions on Electron Devicesno. 11 (2023): 5814-5817
S. Cremer,N. Pelloux,F. Gianesello,Y. Mourier,G. Haury,T. Chaves de Albuquerque,F. Monsieur,H. Audouin,C. A. Legrand,C. Diouf,J. Azevedo Goncalves,C. Belem Goncalves,C. Durand,N. Vulliet,L. Berthier,E. Souchier,P. Garcia,S. Jan,M. Hello,M. L. Rellier,P. Scheer,B. Duriez,X. Garros, T. Bordignon,F. Paillardet,P. Chevalier
ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC) (2023)
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作者统计
#Papers: 186
#Citation: 2028
H-Index: 25
G-Index: 34
Sociability: 6
Diversity: 3
Activity: 14
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