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    • Research Interests
    Silicon-On-InsulatorMosfetCmos ScalingThreshold VoltageSoi200019892026
    19882025

    Papers共 1228 篇Patents共 67 篇Author StatisticsCo-AuthorSimilar Experts

    By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
    时间
    引用量
    主题
    期刊级别
    合作者
    合作机构
    All20252024202320222021202020192018201720162015201420132012201120102009200820072006
    Mechanisms of Forward Current Transport in Vertical Nanoscale Devices: Insights and Applications
    Long Chen, Liting Liu, Hongfu Li,Xingqiang Liu,Yuan Liu, Jean-Pierre Raskin,Denis Flandre,Guoli Li
    Nano Expressno. 1 (2025): 015022
    Cited0Views2Bibtex
    0
    2
    Radiation Degradation and Mitigation of an Ultrathin SOI SPAD Using a Perimeter Gate
    Tom Klauner,Nicolas Roisin, Ottilie Bonfanti,Iman Sabri Alirezaei,Nicolas André,Denis Flandre
    IEEE Transactions on Electron Devicesno. 99 (2025): 1-7
    Cited0Views1EIWOSBibtex
    0
    1
    Wafer-Scale Demonstration of a Highly Sensitive Strain Sensor Based on Polycrystalline VO2
    Zahra Saadat Somaehsofla, Cyrille Masserey, Anna Varini,Denis Flandre,Adrian Mihai Ionescu
    2025 IEEE 38th International Conference on Micro Electro Mechanical Systems (MEMS)pp.635-638, (2025)
    Cited0Views0EIWOSBibtex
    0
    0
    Membrane‐based Mechanical Characterization of Screen‐printed Inks: Deflection Analysis of Ink Layers on Polyimide Membranes
    Eléonore Masarweh, Mariia Arseenko, Philippe Guaino,Denis Flandre
    Applied Research (2024)
    Cited0Views3Bibtex
    0
    3
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    Author Statistics
    00.20.40.60.81#Papers#CitationH-IndexG-IndexSociabilityDiversityActivity

    #Papers: 1229

    #Citation: 21937

    H-Index: 53

    G-Index: 88

    Sociability: 7

    Diversity: 3

    Activity: 29

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    • 合作者
    • 学生
    • 导师
    Jean-Pierre Raskin合作论文数
    Electrical Engineering Department, Institute of Information and Communication Technologies, Electronics and Applied Mathematics, Université Catholique de Louvain258
    Valeriya Kilchytska合作论文数
    ICTEAM Institute, Université catholique de Louvain210
    Laurent A. Francis合作论文数
    ICTEAM, Université catholique de Louvain (UCL),95
    David Bol合作论文数
    Institute of Information and Communication Technologies, Electronics and Applied Mathematics, Ecole Polytechnique de Louvain, Universite Catholique de Louvain94
    Marcelo Antonio Pavanello合作论文数
    Laboratório de Sistemas Integrávels da Escola Politéchnica, da Universidade de São Paulo78
    Nicolas André合作论文数
    77
    Michelly De Souza合作论文数
    Dept Elect Engn, Ctr Univ FEI67
    Jean-Pierre Colinge合作论文数
    65
    Vincent Dessard合作论文数
    63
    Aryan Afzalian合作论文数
    Tyndall National Institute50
    Benjamin Iñiguez Nicolau合作论文数
    Department of Electronic, Electrical and Automatic Control Engineering, University Rovira i Virgili45
    Bertrand Rue合作论文数
    42
    j a martino合作论文数
    LSI/PSI/USP, University of Sao Paulo39
    Jean-Didier Legat合作论文数
    Institute of Information and Communication Technologies, Electronics and Applied Mathematics, Université catholique de Louvain;Louvain School of Engineering, Université catholique de Louvain39
    Alexei Nazarov合作论文数
    Lashkaryov Institute of Semiconductor Physics36
    Remi Pampin合作论文数
    36
    Tamara Rudenko合作论文数
    36
    Luis Moreno Hagelsieb合作论文数
    35
    Christian Renaux合作论文数
    35
    A. Cerdeira合作论文数
    Departamento de Ingeniería Eléctrica, CINVESTAV35
    David Levacq合作论文数
    35
    Nadine Collaert合作论文数
    Imec34
    Benoit Olbrechts合作论文数
    34
    Guoli Li (李国立)合作论文数
    School of Physics & Electronics, Hunan University31
    Olivier Bulteel合作论文数
    30
    Joaquín Alvarado合作论文数
    30
    Numa Couniot合作论文数
    27
    Pierre Delatte合作论文数
    25
    bemard gentinne合作论文数
    24
    Sorin Cristoloveanu合作论文数
    24
    B. Kazemi Esfeh合作论文数
    23
    Salvador Pinillos Gimenez合作论文数
    22
    Xiaohui Tang合作论文数
    Lab. for Microelectron., Katholieke Univ.;c;Lab. for Microelectron., Katholieke Univ.22
    Pierre Gerard合作论文数
    22
    José Remacle合作论文数
    Laboratory of Biochemistry and Cellular Biology, Facultés Universitaires Notre-Dame de la Paix22
    Geoffroy Gosset合作论文数
    22
    j p eggermont合作论文数
    21
    Nicolas Planes合作论文数
    STMicroelectronics21
    Dimitri Lederer合作论文数
    Tyndall National Institute21
    Sergej Makovejev合作论文数
    Sch. of Electr. &Electron. Eng., Newcastle Univ.;c20
    Michel Haond合作论文数
    20
    Sylvain Druart合作论文数
    20
    Maryline Bawedin合作论文数
    Institute of Microelectronics, Electromagnetism and Photonics, Université Catholique de Louvain (UCL),20
    Julien De Vos合作论文数
    Microelectronics Laboratory, Université catholique de Louvain20
    Ratan Kotipalli合作论文数
    CRM Group, Allée de l’Innovation 1, B57- Quartier Polytech 3, 4000, Liège, Belgium19
    Francois Andrieu合作论文数
    CEA-Leti19
    boris foultier合作论文数
    18
    Rodrigo Trevisoli Doria合作论文数
    Departamento de Engenharia Elétrica, Centro Universitário da FEI18
    Fernando A O Silveira合作论文数
    17
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