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    • Research Interests
    Lead-Free SolderMicrostructureShear StrengthInterfacial ReactionElectrical Resistivi...Electrical Resistivity2010202020022026
    20032025

    Papers共 353 篇Patents共 6 篇Author StatisticsCo-AuthorSimilar Experts

    By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
    时间
    引用量
    主题
    期刊级别
    合作者
    合作机构
    Properties of In-Sn-Xcu Alloys and Their Joints on a Cu Substrate Before and after Isothermal Aging
    Le Duy Han,Van Hanh Bui,Van Anh Nguyen,Quang Ngoc Trinh,Hiroshi Nishikawa
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2025)
    Cited0Views2Bibtex
    0
    2
    Fracture Analysis of Micro-vias with Low to High Void Existence at Electroless Cu Plated Layers after Thermal Shock Reliability Cycle Test
    Ming-chun Hsieh,Aiji Suetake, Hiroyoshi Yoshida,Masahiko Nishijima,Rieko Okumura, Zheng Zhang, Hiroki Seto,Yuhei Kitahara, Hirokazu Tanaka, Teruyoshi Hisada,Hiroshi Nishikawa,Katsuaki Suganuma
    2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)pp.304-306, (2024)
    Cited0Views1EIWOSBibtex
    0
    1
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    Author Statistics
    00.20.40.60.81#Papers#CitationH-IndexG-IndexSociabilityDiversityActivity

    #Papers: 171

    #Citation: 6182

    H-Index: 32

    G-Index: 76

    Sociability: 6

    Diversity: 4

    Activity: 1

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    • 合作者
    • 学生
    • 导师
    Tadashi Takemoto合作论文数
    Department of Smart Green Processing, Joining and Welding Research Institute, Osaka University75
    Hiroaki Tatsumi合作论文数
    Osaka City University34
    Siliang He合作论文数
    25
    Omid Mokhtari合作论文数
    Joining & Welding Res. Inst., Osaka Univ.;c;Joining & Welding Res. Inst., Osaka Univ.23
    Zhi Jin合作论文数
    19
    Shiqi Zhou (周士祺)合作论文数
    College of Design and Innovation, Tongji University19
    Min-Su Kim合作论文数
    19
    Yu-An Shen合作论文数
    18
    Chih-han Yang合作论文数
    Department of Materials Science and Engineering, National Cheng Kung University18
    Shih-Yang Lin合作论文数
    18
    Jiahui Li合作论文数
    17
    Mikiko Saito合作论文数
    15
    Fupeng Huo合作论文数
    15
    jun mizuno合作论文数
    15
    Xiangdong Liu (刘向东)合作论文数
    College of Animal Sciences & Technology, Huazhong Agricultural University13
    Shen Yuan合作论文数
    13
    Duy Le Han合作论文数
    School of Mechanical Engineering, Hanoi University of Science and Technology12
    Jianhao Wang合作论文数
    12
    Li-Ngee Ho合作论文数
    12
    Xunda Liu合作论文数
    11
    Myong-Hoon Roh合作论文数
    11
    Yuki Hirata合作论文数
    8
    Nobuo Kamada合作论文数
    8
    Runhua Gao合作论文数
    Tsinghua Berkeley Shenzhen Inst & Tsinghua Shenzhe, Tsinghua Univ8
    Feng Gao合作论文数
    8
    Fangjie Cheng (程方杰)合作论文数
    School of Materials Science and Engineering, Tianjin University8
    C. Robert Kao合作论文数
    Department of Materials Science and Engineering, National Taiwan University8
    Byungho Park合作论文数
    7
    Mutsuo Saito合作论文数
    7
    Takayoshi Ohji合作论文数
    7
    Yan Cheong Chan (陳忍昌)合作论文数
    Department of Electronic Engineering, City University of Hong Kong7
    Tanaka Manabu (田中学)合作论文数
    Joining and Welding Research Institute, Osaka University7
    noriya iwata合作论文数
    6
    Zhang Ke-ke合作论文数
    6
    Sanghun Jin合作论文数
    6
    Han He合作论文数
    6
    Yu-Chen Liu合作论文数
    6
    Katsuaki Suganuma (菅沼克昭)合作论文数
    Institute of Scientific and Industrial Research, Osaka University6
    Michihiko Ike合作论文数
    6
    Shuichi Shoji (庄子習一)合作论文数
    School of Fundamental Science and Engineering, Waseda University6
    Fumiyoshi Kawashiro合作论文数
    6
    Leena Ukkonen合作论文数
    Department of Electronics, Tampere University of Technology6
    Johanna Virkki合作论文数
    6
    KATSUYA AKIHIRO合作论文数
    5
    minoru ueshima合作论文数
    5
    Shutetsu Kanayama合作论文数
    5
    Koji Ishikawa合作论文数
    5
    Soichi Homma合作论文数
    5
    Chuncheng Wang合作论文数
    5
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