I am an expert in materials science and engineering with special expertise in plasma assisted chemical vapor deposition (PECVD) of materials. I have applied his skills to investigate the deposition of diamond-like carbon (DLC) as a protective coating for magnetic recording media and developed applications of DLC for thin films disks and heads. I am the primary inventor of the low-k and ultralow-k SiCOH and porous pSiCOH insulators that replaced the silicon dioxide as interconnect dielectrics for improved chip performance. Under my leadership and due to my expertise, the materials developed in IBM Research have been further improved to manufacturable quality and have been implemented in IBM's microprocessors at the 90 nm technology node and beyond. Since 2007 I have expanded my activities into the development of wafer-scale epitaxial graphene, a material with strong potentials for future nanoelectronics technology.