Abhitosh Vais - Adv RF Grp, IMEC | 人才画像

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An Adaptable In(Ga)P/Ga(Sb)As/Ga(In)As HBT Technology on 300 Mm Si for RF Applications

Annie Kumar,Sachin Yadav,Abhitosh Vais,Guillaume Boccardi,Yves Mols,Reynald Alcotte,Bertrand Parvais,Bernardette Kunert,Nadine Collaert

2024 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM, IMS 2024pp.940-943, (2024)

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(Invited) Integration of InP Heterojunction Bipolar Transistors on Silicon Substrates for 6G Networks

Bernardette Kunert,Yves Mols,Reynald Alcotte,Peter Swekis,Sachin Yadav,Abhitosh Vais,Akash Kumar,G. Boccardi,Róbert Langer,B. Parvais,Nadine Collaert

Meeting abstracts/Meeting abstracts (Electrochemical Society CD-ROM)no. 33 (2023): 1852-1852

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(Invited) Integration of InP Heterojunction Bipolar Transistors on Silicon Substrates for 6G Networks

Bernardette Kunert,Yves Mols,Reynald Alcotte,Peter Swekis,Sachin Yadav,Abhitosh Vais,Akash Kumar,G. Boccardi,Róbert Langer,B. Parvais,Nadine Collaert

ECS transactionsno. 1 (2023): 105-116

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Thermal Modelling of GaN & InP RF Devices with Intrinsic Account for Nanoscale Transport Effects

B. Vermeersch,R. Rodriguez,A. Sibaja-Hernandez,A. Vais,S. Yadav,B. Parvais,N. Collaert

2022 International Electron Devices Meeting (IEDM) (2022)

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III-V HBTs on 300 Mm Si Substrates Using Merged Nano-Ridges and Its Application in the Study of Impact of Defects on DC and RF Performance

A. Vais,S. Yadav,Y. Mols,B. Vermeersch, K. V. Kodandarama,M. Baryshnikova,G. Mannaert,R. Alcotte,G. Boccardi,P. Wambacq,B. Parvais,R. Langer,B. Kunert,N. Collaert

European Solid-State Device Research Conference（2022）

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III-V/III-N Technologies for Next Generation High-Capacity Wireless Communication

N. Collaert,A. Alian,A. Banerjee,G. Boccardi,P. Cardinael,V. Chauhan,C. Desset,R. ElKashlan,A. Khaled,M. Ingels,B. Kunert,Y. Mols,B. O'Sullivan,U. Peralagu, N. Pinho,R. Rodriguez,A. Sibaja-Hernandez, S. Sinha, X. Sun,A. Vais,B. Vermeersch,S. Yadav, D. Yan,H. Yu, Y. Zhang,M. Zhao,J. Van Driessche, G. Gramegna,P. Wambacq,B. Parvais,M. Peeters

2022 International Electron Devices Meeting (IEDM)（2022）

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III-V on a Si Platform for the Next Generations of Communication Systems

B. Parvais,A. Vais,S. Yadav,Y. Mols,B. Vermeersch, K. Vondkar Kodanarama,G. Boccardi,B. Kunert,N. Collaert

2022 6th IEEE Electron Devices Technology &amp Manufacturing Conference (EDTM) (2022)

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DC and RF Characterization of Nano-ridge HBT Technology Integrated on 300 Mm Si Substrates

S. Yadav,A. Vais,R. Y. ElKashlan,L. Witters,K. Vondkar,Y. Mols,A. Walke,H. Yu,R. Alcotte,M. Ingels,P. Wambacq,R. Langer,B. Kunert,N. Waldron,B. Parvais,N. Collaert

2020 15TH EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC)（2021）

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A Defect Characterization Technique for the Sidewall Surface of Nano-ridge and Nanowire Based Logic and RF Technologies

A. Vais,B. Hsu,O. Syshchyk,H. Yu,A. Alian,Y. Mols, K. Kodandarama,B. Kunert,N. Waldron, E. Simoen,N. Collaert

IEEE International Reliability Physics Symposium（2021）

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III/V Nano-ridge Engineering for Device Integration on 300 Mm Silicon

Bernardette Kunert,Davide Colucci,Marina Baryshnikova,Yves Mols,Reynald Alcotte,Dries Van Thourhout,Cenk Ibrahim Özdemir,Yannick De Koninck,Nadezda Kuznetsova,Didit Yudistira, M. Pantouvaki, J. Van Campenhout,Abhitosh Vais, Shyam Sundar Yadav,A. Sibaja-Hernandez, Bertrand Parvais,Nadine Collaert,Róbert Langer

openalex（2021）

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