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Martin Drost received the Dipl.-Chem. degree in chemistry and the Ph.D. degree in electron beam-induced processing of nanostructures from the University of Erlangen-Nuremberg, Erlangen, Germany, in 2012 and 2017, respectively.
He joined the Technology Department, IHP–Leibniz-Institut für innovative Mikroelektronik, Frankfurt, Germany, and started working on the development of plasma etch processes, with a focus on back-end-of-line (BEOL) etching of metals and ILDs, and deep Si etching.
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2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)pp.1-4, (2022)
Micro and nano engineering (2022): 100102-100102
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 6 (2022): 921-932
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