基本信息
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个人简介
AWARD
• 2017 Qualcomm Innovation Award, Mar. 2018.
• Microsoft AI for Earth (ICLR Workshop Paper [W3]), May. 2020.
• 2021 Qualcomm Innovation Fellowship (AAAI Paper [C3]), Nov. 2021.
• 2021 Korean Artificial Intelligence Association, Best Paper Award (BMVC Paper [C8]).
• 2022 Korean Artificial Intelligence Association, Best Paper Award (ECCV Paper [C9]
• 2017 Qualcomm Innovation Award, Mar. 2018.
• Microsoft AI for Earth (ICLR Workshop Paper [W3]), May. 2020.
• 2021 Qualcomm Innovation Fellowship (AAAI Paper [C3]), Nov. 2021.
• 2021 Korean Artificial Intelligence Association, Best Paper Award (BMVC Paper [C8]).
• 2022 Korean Artificial Intelligence Association, Best Paper Award (ECCV Paper [C9]
研究兴趣
论文共 47 篇作者统计合作学者相似作者
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AAAI 2024no. 12 (2024): 13113-13121
ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)pp.7465-7469, (2024)
Byungsoo Jeon, Mengdi Wu,Shiyi Cao,Sunghyun Kim,Sunghyun Park, Neeraj Aggarwal,Colin Unger,Daiyaan Arfeen,Peiyuan Liao,Xupeng Miao,Mohammad Alizadeh,Gregory R. Ganger,
arxiv(2024)
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ENGINEERING APPLICATIONS OF ARTIFICIAL INTELLIGENCEno. Part B (2024): 107283-107283
Computers in biology and medicine (2023): 107453-107453
ICML 2023pp.19036-19052, (2023)
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