Han-Tang Hung - Dept Mat Sci & Engn, Natl Taiwan Univ

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Experimental and Thermodynamic Assessment of the Cu–In System

Fu-Ling Chang, Yu-Hsin Lin,Han-Tang Hung,C. R. Kao

CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (2024)

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Artifact-Free Microstructures in the Interfacial Reaction Between Eutectic In-48Sn and Cu Using Ion Milling

Fu-Ling Chang, Yu-Hsin Lin,Han-Tang Hung, Chen-Wei Kao,C. R. Kao

Materialsno. 9 (2023): 3290-3290

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C-Axis Aligned Crystalline InSnZnO Thin Film Using Mist Chemical Vapor Deposition and Deposition/Annealing Cyclic Method for Thin-Film Transistors Applications

Han-Yin Liu,Hao-Chun Hung,Yu-Liang Hsu,Ching-Sung Lee, Meng-Yu Hsu,Yi-Jie Liu, Yu-Ting Huang,Wei-Chou Hsu

IEEE TRANSACTIONS ON ELECTRON DEVICESno. 7 (2023): 3617-3623

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Long-Term Aging Study on the Solid State Interfacial Reactions of in on Cu Substrate

Han-Tang Hung,Fu-Ling Chang,Chin-Hao Tsai,Chia-Yi Liao,C. R. Kao

Materialsno. 18 (2023)

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Low-temperature transient liquid phase bonding via electroplated Sn/In-Sn metallization

Chin-Hao Tsai,Han-Tang Hung,Fu-Ling Chang,Steffen Bickel,Maik Mueller,Iuliana Panchenko,Karlheinz Bock,C. R. Kao

JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T（2022）

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Highly uniform microfluidic electroless interconnections for chip stacking applications

H. T. Hung, Z. D. Ma,P. S. Shih,J. H. Huang,L. Y. Kao,C. Y. Yang,Vengudusamy Renganathan,C. L. Kao,Y. C. Hung,C. R. Kao

ELECTROCHIMICA ACTA（2021）

引用17浏览0引用

Examine persuasion strategies in Chinese on social media

Yu-Yun Chang,Po-Ya Angela Wang,Han-Tang Hung, Ka-Sîng Khóo,Shu-Kai Hsieh

Pacific Asia Conference on Language, Information and Computation (PACLIC)（2021）

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Artifact-free Microstructures of the Cu–In Reaction by Using Cryogenic Broad Argon Beam Ion Polishing

H. T. Hung,P. T. Lee,C. H. Tsai,C. R. Kao

Journal of Materials Research and Technology（2020）

引用9浏览0引用

Vertical Interconnections by Electroless Au Deposition on Electroless Ni Immersion Au Surface Finish

I. A. Weng,H. T. Hung,W. C. Huang,C. R. Kao,Y. H. Chen

Journal of electronic materials（2020）

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The Real Demonstration of High-Quality Carbon Nano-Tubes (cnts) As the Electrical Connection for the Potential Application in a Vertical 3D Integrated Technology

P-Y Lu,Y-R Li, C-M Yen,H-T Hung,C-R Kao, W-C Pu,C-C A. Chen,M-H Lee,M-H Liao

2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)（2020）

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