基本信息
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职业迁徙
个人简介
Alfonso Ortega received the B.S. degree from the University of Texas-El Paso, El Paso, TX, USA, and the M.S. and Ph.D. degrees from Stanford University, Stanford, CA, USA, all in mechanical engineering.
He was a technical staff member with Sandia National Laboratories, Albuquerque, NM, USA, for six years, where he was involved in solar and geothermal energy research. He has authored over 300 journal and symposia papers, book chapters, and monographs. His current research interests include thermal management in electronic systems, convective and conjugate heat transfer in complex flows, experimental measurements in the thermal sciences, and thermal management in energy systems.
Prof. Ortega is a fellow of the American Society of Mechanical Engineers (ASME). He received the ASME Electronic Packaging Division Thermal Management Award, and the SEMITHERM Significant Contributor Award. He is currently an Associate Editor of the ASME Journal of Heat Transfer. He was an Associate Editor of the ASME Journal of Electronic Packaging and a Guest Associate Editor of the IEEE Transactions on Components, Packaging, and Manufacturing Technology. He was the Chair of the ASME K16 Committee on Heat Transfer in Electronic Equipment and the ASME Electronic and Photonic Packaging Division.
研究兴趣
论文共 127 篇作者统计合作学者相似作者
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引用量
主题
期刊级别
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合作机构
JOURNAL OF ELECTRONIC PACKAGINGno. 2 (2024)
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-10, (2023)
Ghazal Mohsenian,Yaman Manaserh,Mohammad Tradat, Srikanth Rangarjan,Ayushman Singh, Koroush Nemati,Alfonso Ortega,Bahgat Sammakia
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-9, (2023)
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-7, (2023)
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-9, (2023)
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-10, (2023)
2023 39th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)pp.1-7, (2023)
PROCEEDINGS OF ASME 2022 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2022 (2022)
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作者统计
#Papers: 126
#Citation: 1482
H-Index: 23
G-Index: 34
Sociability: 5
Diversity: 2
Activity: 40
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