On-the-fly Defect-Aware Design of Circuits Based on Silicon Dangling Bond Logic
2024 IEEE 24th International Conference on Nanotechnology (NANO)（2024）
关键词
Circuit Design,Dangling Bonds,Experimental Evaluation,Presence Of Defects,Atomic Scale,Latest Advances,Latest Findings,Physical Design,Atomic Defects,Design Process,Aspect Ratio,Presence Of Complex,Sophisticated Approaches,Standard Library,Blacklist,Scanning Tunneling Microscopy,Present Size,Physical Simulation,Radical Approach,Boolean Function,Charged Defects,Silicon Crystal,Correct Output
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