Impact of Wire Bonding Layout on Power Cycle Capability for 10 Kv Sic-Mosfet Power ModulesMASAKI TAKAHASHI,Zhongchao Sun,Stig Munk-Nielsen,Asger Bjørn Jørgensencrossref(2024)引用 0|浏览3暂无评分AI 理解论文溯源树样例生成溯源树,研究论文发展脉络Chat Paper正在生成论文摘要