Physics-Based Modeling for Determining Transient Current Flow In Multi-layer PCB PI Designs

A physics-based modeling methodology for determining the transient current flow path in multi-layer PI designs is given in this paper using a commercial board with a complicated structure as an example. Board structure analysis is done first to provide a physical basis of post-layout analytical and equivalent circuit modeling. A match of the PDN impedance between commercial tool simulation, post-layout analytical calculation, and the physics-based equivalent circuit modeling was achieved to support the model for the transient simulation. By analyzing the current response in all the vias, a clear representation of transient current flow across all via segments can be given layer-by-layer. The maximum current density in vertical vias can also be extracted in this process, providing a reference for preventing transient overcurrent design.