MoP-23 FABRICATION OF EMBEDDED GOLD MICRO ELECTRODE WITH PI IN PDMS SUBSTRATE USING MODIFIED DRY PEEL-OFF PROCESS

Ryohei Ueno, Ikjoon Byun,Yuki Mizuno,Beomjoon Kim

Proceedings of JSME-IIP/ASME-ISPS Joint Conference on Micromechatronics for Information and Precision Equipment（2015）

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摘要

The present paper describes a modified dry peel-off process to fabricate stable gold micro electrode with polyimide (PI) embedded in a polydimethlysiloxane (PDMS) substrate. three kinds of self-assembled monolayer (SAM) were employed to control adhesion strength and to transfer gold micro electrodes from silicon substrate in driect.

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