Design and Fabrication of Microwave Module with Multiple Liquid Crystal Polymer Flex

In this paper, we present the design and fabrication of low noise amplified module with multilayer liquid crystal polymer (LCP) flex. The technological process of module fabrication is designed according to the module structure. The lamination process is optimized to enhance the lamination strength and eliminate the wrinkle. The LCP substrate is conformed to 0 degree, 10 degree and 45 degree before die bonding to protect the chip from bending strength. The results show that the module remain well performance at different curvature. The LCP substrate has a good potential in flexible front-end module.