LED封装用Ag/Pd/Au合金键合线的发展研究
Mechanical Engineer（2016）
Abstract
分析了当前电子封装用线材的分类以及不同线材的优缺点.介绍了一种新型LED封装用Ag/Pd/Au键合合金线.分析了Ag/Pd/Au键合合金线的力学性能、电学性能以及抗腐蚀性与可靠性.在此基础上阐述了Ag/Pd/Au键合合金线替代键合金线的可行性.
MoreAI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined