High Electromigration Resistance of Nanotwinned Cu Used in Redistribution Layers of Fan-out
Impact（2020）
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large-scale IC,IC industry,3D IC,solder joints,highly preferred orientation nanotwinned copper,bulk copper,nanoscale twins,electromigration tests,electromigration lifetimes,nt-Cu RDL lines,high electromigration resistance,redistribution layers,commercial electronic products,redistribution lines,fan-out packages,three dimensional integrated circuit,current density,Cu
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