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Improved S-Parameter Measurements Of Embedded Planar Transmission-Line On Multi-Layer Pcb

2018 CONFERENCE ON PRECISION ELECTROMAGNETIC MEASUREMENTS (CPEM 2018)(2018)

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Abstract
This paper describes improved calibration method for measuring the scattering parameters of an embedded planar transmission line on multi-layer printed circuit board (PCB) substrate from 100 MHz to 40 GHz. When using a Vector Network Analyzer (VNA) to measure the scattering parameters (S-parameters) of printed circuit board (PCB) interconnects, it can be advantageous to include the calibration and verification standards on the same PCB as the interconnects under test. Both designs of on-PCB standards and calibrated results of verification standards are presented.
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Key words
multi-layer PCB, planar transmission-line, S-parameter measurement, TRL calibration
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