Peel-Off Characteristics at Interface Between Base Film and Dielectrics with Spin-Coating Film Transfer and Hot-Pressing Technology

This paper describes the peel-off characteristics of spin-coating film transfer and hot-pressing (STP) technology. STP technology is a new film-formation technology that enables the transfer of a dielectric on a base film onto a wafer by hot pressing. The base film is then peeled off at the interface between the base film and the dielectric. It is examined to control the peel force by the surface treatment of the base film of a fluoropolymer and STP process conditions. An apparatus for measuring peel force during peel off is also devised. The measurement results clarified that the magnitude of the normalized peel force ranges from about 2 to 3 N/cm for a 1-µm-thick dielectric, depending on the surface treatment and STP process conditions. The X-ray photoelectron spectroscopy spectrum of the surface of the base film after peel off indicated that peel off was carried out at the interface. Therefore, it is confirmed that STP technology enables the control of the characteristics of peel off.