Oriented BN/BNNT heterostructure constructed by interface engineering strategy for polyamide-imide composite film with advanced flexibility and thermally conductive properties

Thermal conductive polymeric materials have aroused increasing attention as thermal management materials in the field of intelligent electronic devices due to their intriguing advantages. However, the discontinuity of phonon transmission path construction represents the bottleneck for thermal conductivity enhancement of composite materials, which limits the practical application of composite materials. Herein, flexible polyamideimide (PAI) thermally conductive composite films with hierarchical structure composed of synergistically assembled functionalized boron nitride nanosheets (FBN) and polydopamine (PDA)-modified boron nitride nanotubes (FBT) by layer-by-layer assembly strategy are constructed. Benefitting from the optimized interface engineering with the ordered oriented arrangement FBN/FBT filler structure, the obtained composite film with optimized hybrid filler contents exhibits the super high thermal conductivity of 71.1 W center dot m(-1)center dot K-1, prominent thermal conductivity enhancement as high as 3663 % and excellent mechanical flexibility. The introduction of FBT can further expand the thermal contact area attributed to its inherent high thermal conductivity and aspect ratio. Additionally, the consecutive dual-channel phono transmission paths can be constructed in PAI composites under the synergistic action of FBN and FBT, further improving the phonon transmission density and suppressing phonon scattering, which endows PAI composite films with excellent thermal conductivity under low load of filler. The resulting multifunctionalities make the PAI composite films promising for flexible intelligent wearable electronic devices as thermal management materials.