Isolation Enhancement Between Two Low-Profile Patch Antennas for In-Band Full-Duplex Applications
IEEE Antennas and Wireless Propagation Letters(2024)
摘要
An enhanced isolation technique between two low-profile patch antennas is proposed. Two identical antennas are configured with two PCBs spaced at 0.206 λ
0
, where λ
0
is the free-space wavelength at 3.5 GHz. Every antenna is a rectangular patch with four slots and two vias, vertically fed with a coaxial probe. A decoupling strip embedded between two antennas and a slot on the ground improves isolation, which would not deteriorate the cross-polarization and backward radiation levels. Two-port impedance match and isolation characteristics are analyzed when the two-antenna spacing varies from 0.159 λ
0
to 0.252 λ
0
. The proposed antenna has a size of 0.817 λ
0
× 0.448 λ
0
× 0.038 λ
0
. The fabricated prototype is measured, and the results demonstrate that the -10 dB impedance bandwidths are 3.37–3.61 GHz (6.88%), the port-to-port isolation is more than 45.2 dB, the realized gains are 4.53 ± 0.35 dBi, and the average radiation efficiencies are more than 70%. Therefore, the measured results agree well with the simulated, making it a promising candidate for in-band full-duplex applications in 5G terminal scenes.
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关键词
High isolation,in-band full-duplex,low profile,patch antenna,spatial decoupling
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