Enhanced curing process of eco-friendly oxidized cornstarch adhesive with Nano-CeO₂

This paper investigates the development of an eco-friendly adhesive fortified with cerium dioxide nanoparticles (nano-CeO2), incorporating oxidized corn starch (OCS) and a Polyvinyl acetate (PVAc) emulsion. Initially, OCS was prepared through an oxidation reaction, and its chemical structural attributes were explored using FT-IR, XRD, DSC, viscosity, and carboxyl value analysis. Subsequently, the adhesive formulation (OCS-PVAc-CeO2) was synthesized, demonstrating substantial improvements in both strength and curing kinetics due to the inclusion of nano-CeO2, as confirmed by SEM surface morphology analysis. Laboratory-scale evaluations of this adhesive confirmed its suitability for the packaging industry due to its rapid curing process and enhanced mechanical properties.