Hybrid Integrated Full-Chip Photonic Payloads Based on InP and Si3N4 platform

Here, we demonstrate a hybrid integrated photonic satellite repeater with large-scale multiplexing potential and high flexibility. Hybrid integration of InP/Si3N4 external cavity laser, arrayed InP modulators and semiconductor optical amplifier (SOAs), as well as multifunctional Si3N4 signal processors, to fulfill a 1x4 Ka-band repeater module with on-chip arrayed frequency down-conversion and outstanding narrowband photonic channelization. Combined with the full-chip photonic repeater, broadband, highly integrated, and cost-effective communications satellite payloads would become realizable more quickly in the near future.