Synergistic Integration: An Optimal Combination of On-Die and Rank-Level ECC for Enhanced Reliability

2023 20TH INTERNATIONAL SOC DESIGN CONFERENCE, ISOCC(2023)

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摘要
Memory reliability is especially key to attaining resilience at scale, where effective error detection and correction are essential for ensuring data integrity and preventing system failures. Technologies such as On-Die Error Correction Code (OD-ECC) and Rank-Level ECC (RL-ECC) have evolved independently, mitigating various errors and enhancing reliability. However, investigating an optimal combination between OD-ECC and RL-ECC could lead to further improvements. In particular, the optimal scheme and mapping between OD-ECC with Bounded Fault (BF) applied and RL-ECC in DDR5 have yet to be explored. This paper investigates the importance of scheme consistency for reliability in memory sub-systems and provides guidelines for RL-ECC design for system companies.
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关键词
DDR5,On-die ECC,Rank-level ECC,Reliability
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