140-GHz 2-D Scalable On-Grid 8 $\times$ 8-Element Transmit–Receive Phased Arrays With Up/Down Converters Demonstrating a 5.2-m Link at 16 Gbps
IEEE Transactions on Microwave Theory and Techniques(2024)
摘要
This article presents a 140-GHz 2-D scalable wafer-scale transmit-receive (TRX) phased array based on radio frequency (RF) beamforming with 4-bit for both phase and gain controls. The chip is composed of
$8\times8$
RF channels each having transmit and receive circuits, in addition to a TRX single-pole double-throw (SPDT) switch. One of the elements is replaced with an up/down-converter (UDC) channel composed of mixers, a
$\times$
6 LO multiplier chain, and intermediate frequency (IF) amplifiers at 9–14 GHz. The on-chip UDC channel is the interface between the IF signals on a printed circuit board (PCB) and the TX/RX RF distribution networks (DNs) on a chip. The 140-GHz DN is composed of coplanar waveguide (CPW) lines, Wilkinson dividers/combiners, and line amplifiers (LAs) to provide signal amplification. The chip occupies an area of 9.84
$\times$
8.27
$\text{mm}^2$
and is designed and fabricated in GlobalFoundries, Malta, NY, USA, CMOS 45RFSOI technology. The chip is flipped on a low-cost organic RF PCB containing
$8\times8$
patch antenna array placed at 1.
$07\times1$
.22
$\text{mm}^2$
grid (0.5
$\lambda$
$\times$
0.57
$\lambda$
at 140 GHz). The array electronically scans up to
$\pm$
60
$^{\circ}$
in the
$H$
-plane and
$\pm$
38
$^{\circ}$
in the
$E$
-plane for both TX and RX operations. Over-the-air (OTA) measured performance of the array demonstrates TX peak effective isotropic radiated power (EIRP) of 34-37.5 dBm at 137.5-145 GHz and RX input 1-dB compression point (P1dB) of
$-$
12 to
$-$
9 dBm at 134–143 GHz. Communication link measured for both TX and RX operations supports modulated 16-/64-quadrature amplitude modulation (QAM) signals with up to 24 Gb/s data rates with an rms EVM less than 7%/6%. In addition, a TRX phased array wireless links at 1.45 m and 5.2 meters are demonstrated with data rates up to 20 and 16 Gb/s using 16-QAM modulated signal and an rms EVM less than 9% for the 1.45 m link. To the best of the authors’ knowledge, this article presents the highest reported EIRP of 37.5 dBm for wafer-scale arrays in silicon technologies.
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关键词
Antenna,beamforming,CMOS silicon on isolator (SOI),$D$ -band,effective isotropic radiated power (EIRP),error vector magnitude (EVM),integrated circuits (ICs),140 GHz,phased-arrays,radio frequency (RF),receiver,6G,transmitter,wafer-scale,wireless communication
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