3D Printed Electronic Skin for Strain, Pressure and Temperature Sensing

ADVANCED FUNCTIONAL MATERIALS(2024)

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摘要
Electronic skin (E-skin) that can mimic the flexibility and stretchability of human skin with sensing capabilities, holds transformative potential in robotics, wearable technology, and healthcare. However, developing E-skin poses significant challenges such as creating durable materials with skin-like flexibility, integrating biosensing abilities, and using advanced fabrication techniques for wearable or implantable applications. To overcome these hurdles, a 3D-printed electronic skin utilizing a novel class of nanoengineered hydrogels with tunable electronic and thermal biosensing capabilities is fabricated. This methodology takes advantage of the shear-thinning behavior in hydrogel precursors, allowing to construct intricate 2D and 3D electronic structures. The elasticity of skin using triple crosslinking in a robust fungal exopolysaccharide, and pullulan is simulated, while defect-rich 2D molybdenum disulfide (MoS2) nanoassemblies ensure high electrical conductivity. The addition of polydopamine nanoparticles enhances adhesion to wet tissue. The hydrogel exhibits outstanding flexibility, stretchability, adhesion, moldability, and electrical conductivity. A distinctive feature of this technology is the precise detection of dynamic changes in strain, pressure, and temperature. As a human motion tracker, phonatory-recognition platform, flexible touchpad, and thermometer, this technology represents a breakthrough in flexible wearable skins and holds transformative potential for the future of robotics and human-machine interfaces. 3D printed electronic skin is fabricated utilizing triple crosslinked nanoengineered hydrogels with tunable mechanical properties with electronic and thermal sensing capabilities. The engineered e-skin is flexible, moldable, stretchable, and adhesive and holds significant promise in electronic wearable skin, soft robotics, and actuators.image
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关键词
3D printing,electronic skin,flexible electronics,hydrogels,nanocomposite
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