Avalanche Photodiode with Multiple Multiplication-Layers and Flip-Chip Bonding Package for 4-D FMCW LiDAR Applications

APDs with multiple multiplication-layers and flip-chip bonding package is demonstrated. It exhibits wide 3-dB bandwidths (4.8GHz), high responsivity (10.7A/W), and high saturation current (>4.3mA) at 0.9V(br). Using this device, we obtain superior quality of 4-D images to that of p-i-n PD in FWCW LiDAR system.