Ultra-fast electrodeposition of dynamic hydrogen bubble template nickel sulfide on a porous copper layer as an electrocatalyst toward hydrogen evolution reaction

Finding cost-effective electrocatalysts that can match the performance of noble metals like platinum is crucial for renewable hydrogen energy generation. In this study, the electrocatalytic properties of a nickel sulfide compound deposited on a porous copper network that is formed on a nickel foam substrate are investigated. To achieve this goal, the dynamic hydrogen bubble template method was employed. Copper and nickel sulfide electrodeposited in 5 s at 6 A cm-2. The presence of the copper layer resulted in a potential requirement of 98 mV, to achieve current densities of 10 mA cm-2, compared to 120 mV, when the porous copper substrate was not present. The ECSA was found to be significantly increased by the presence of the copper layer, as determined by examining the CV test and calculating the electrochemically active surface area. Ni3S2@Cu@NF is an excellent choice for electrocatalyst when it comes to HER in alkaline media.