Thermal switching of $\text{TiO}_{2}$ -based RRAM for parameter extraction and neuromorphic engineering

ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC)(2022)

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摘要
Recently, resistive switching random access memory (RRAM) has gained maturity for storage class memory and in-memory computing. For these applications, an improved control of the switching phenomena can lead to higher data density and computing accuracy, thus paving the way for RRAM-based artificial intelligence (AI) accelerators for edge computing. This work presents a study of thermally-induced switching in $\text{TiO}_{2}$ -based RRAM devices. Thermal switching is explained by defect rediffusion controlled by the activation energy for defect migration in $\text{TiO}_{2}$ . Experiments and simulations support thermal switching as a tool for parameter extraction in RRAM, as well as for novel neuromorphic cognitive functions for brain-inspired computing.
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关键词
rram,neuromorphic engineering,thermal switching
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