A Scalable 16-Element 76-to-81 GHz Phased Array Antenna-in-Package for Automotive Radar

Kevin Gu, Hadi Saedi Manesh, Neda Bathaei, Rick Heckler, Ray Haynes, Andrew Bonthron

2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI)（2023）

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摘要

A compact 12.4 $4\text{mm} \times 10.2$ mm $\times 0.7\ \text{mm}$ flip-chip chip-scale package (FCCSP) with integrated antennas is presented for automotive radar applications. 16 $(4\times 4)$ wideband (76–81 GHz) slot-coupled patch antennas are embedded with uniform spacings in this 10-layer antenna-in-package (AiP), which can be further tiled to create a larger array aperture. Antenna feeds and transitions are optimized for bonding a 16-channel phased array front-end transmit (TX) or receive (RX) beamforming IC. Antenna bandwidth and radiation patterns are verified by full-wave package-level electromagnetic simulation. Measurement results of near-ideal in-air power combining of the AiP module are also demonstrated.

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关键词

0.7mm flip-chip chip-scale package,16-channel phasedarray front-end transmit,16-element 76-to-81 GHz,array antenna-in-package,automotive radar applications,frequency 76.0 GHz to 81.0 GHz,integrated antennas,larger array aperture,radiation patterns,size 0.7 mm,size 10.2 mm,size 12.4 mm,uniform spacingsin this10-layer antenna-in-package

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