A GPU-Accelerated ADI Method for Thermal Simulation of Liquid-Cooled 3-D ICs
2023 International Symposium of Electronics Design Automation (ISEDA)(2023)
摘要
This paper presents an efficient methodology for the transient thermal simulation of liquid-cooled 3-D integrated circuits (ICs). A compact thermal network model and the alternating direction implicit (ADI) method accelerated by graphics processing unit (GPU) are employed to improve computational efficiency. The simulation result shows that the proposed method can significantly reduce the computational time cost while maintaining satisfactory accuracy.
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关键词
Alternating direction implicit (ADI) method,graphics processing unit (GPU),transient thermal simulation
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