Impact of interconnects enhancement on SRAM design beyond 5nm technology node.

This paper presents an extensive study of 6T-SRAM based on FinFET for advanced technology nodes beyond 5nm. We deduce that parasitic resistance becomes the main bottleneck for SRAM design at these nodes. SRAM's writing margin and read speed are impacted due to the increased Bit-Line (BL) and Word-Line (WL) resistance. This work primarily explores two possible solutions to improve the parasitic resistance at advanced process technology nodes: 1) strapping of BL and WL to higher metal, and 2) adopting the resistance optimized BEOL. Strapping BL and WL to higher metal layer improves the Write Trip Point (WTP) by similar to 100mV and the critical path delay by 24% at the cost of 50% higher energy. Resistance optimized BEOL can improve WTP by similar to 50mV more and delay by 25% more, at the cost of increased energy consumption (8%).