Highly Integrated DBC-based IPM with Ultra-compact Size for Low Power Motor Drive Applications

This paper proposes the new series highly integrated intel-ligent power module (IPM), which is developed to provide a ultra-compact, high performance and reliable motor drive system. Details of the key de-sign technologies of the IPM is given and practical application issues such as electrical characteristics, system operation performance and power dis-sipation are discussed. Layout placement and routing have been optimized in order to reduce and balance the parasitic impedances. By implementing an innovative direct bonding copper (DBC) ceramic substrate, which can effectively dissipate heat, the IPM delivers a fully integrated power stages including two three-phase inverters, power factor correction (PFC) and rec-tifier in an ultra-compact 75.5 mm x 30 mm package, offering up to a 17.3 percent smaller space than traditional motor drive scheme.