A 200Gb/s Low Power DSP-Based Optical Receiver and Transmitter with Integrated TIA and Laser Drivers.

A. Zafrany, D. Burgos, L. Cai, S. Chong, C. Cramm, S. Dadash,V. Giridharan, V. Gurumoorthy, B. Helal, C. Ho, A. Iyer, S. Jantzi, C. Loi, T. Nguyen, K. Parker, E. Pillai, K. Raviprakash, S. Ray, P. Rossi, Z. Sun,A. Tan, L. Tse, B. Wall,L. Wang, J. Wang, T. Wu

OFC（2023）

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摘要

Fully integrated low power 200Gb/s DSP based optical transmitter and receiver ICs with transmitter chip incorporating fully integrated laser drivers and receiver chip with fully integrated Transimpedance amplifier (TIA) in 16nm FinFet using wirebond technology.

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关键词

FinFet,fully integrated laser drivers,fully integrated transimpedance amplifier,integrated TIA,low power DSP-based optical transmitter,low power DSP-based optical receiver,optical receiver IC,optical transmitter IC,receiver chip,size 16.0 nm,transmitter chip,wirebond technology

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