Reliability challenges in Forksheet Devices: (Invited Paper)

E. Bury, M. Vandemaele,J. Franco, A. Chasin, S. Tyaginov, A. Vandooren,R. Ritzenthaler, H. Mertens, J. Diaz Fortuny,N. Horiguchi, D. Linten, B. Kaczer

2023 IEEE International Reliability Physics Symposium (IRPS)(2023)

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摘要
The forksheet (FSH) device architecture is a possible candidate towards continued logic cell downscaling. It consists of vertically stacked n- and p-type sheets at opposing sides of a dielectric wall. In this work, we overview the time-0 and time-dependent performance of n and p-type FSH field-effect transistors co-integrated with nanosheets (NSH) in individual wafers. A separate assessment of dedicated capacitors yields indications of a non-negligible effect of negative fixed charges trapped in low-temperature deposited SiO 2 , currently used as dielectric wall liner. Finally, we evaluate the impact of using a bottom dielectric isolation (BDI) instead of a junction-based electrical isolation of the sheets from the substrate.
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关键词
Forksheet FETs,FSH,BDI,Nanosheet FETs,NSH,hot-carrier degradation,HCD,trapping,oxide defects,FET arrays,bottom dielectric isolation
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