A 16 GB 1024 GB/s HBM3 DRAM With Source-Synchronized Bus Design and On-Die Error Control Scheme for Enhanced RAS Features

This article proposes practical design techniques to enhance performance and reliability of 1024 GB/s high-bandwidth memory-3 (HBM3). Effective data-bus design methods are applied to transfer data from multi-bank to a data-bus with a sufficient data fetch margin. A symbol-based on-die error-correcting code (OD-ECC) to correct a 16-bit error, bounded by a sub-wordline (WL), and parallelized data-bus inversion (DBI) are implemented. Error check and scrub (ECS) mode and repair capability check (RCC) mode with an internal serial interface are designed to support system reliability, availability, and serviceability (RAS). A memory built-in self-test (MBIST) provides a unified at-speed test with programmability based on test-set units (TUs). A 16 GB HBM3 fabricated in the third generation of the 10 nm class DRAM process achieves a bandwidth up to 1024 GB/s (8 Gb/s/pin) and provides stable operation at a high temperature (e.g., 105 °C) while improving an error detection rate by 92.2%.