System on a Package Innovations With Universal Chiplet Interconnect Express (UCIe) Interconnect

IEEE Micro(2023)

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摘要
Universal Chiplet Interconnect Express (UCIe) is an open industry standard interconnect for developing an open chiplet ecosystem, where chiplets from any supplier can be packaged anywhere in an interoperable manner. This article delves into the architectural and protocol aspects that we developed and have been adopted in the UCIe 1.0 specification. We present our results on these aspects based on our implementation studies.
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关键词
Chiplet,Packaging,Compute Express Link,Rack Scale Architecture,Accelerator,Memory expansion,Co-packaged optics,Pooling,PCI Express,Reliability,Availability,Power-Efficiency
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