Study on Warpage of Interposer by Chip Distribution

Glass interposer have gradually become an effective substitute for silicon and ceramic substrates due to their high-frequency performance, excellent electrical isolation, low price, and could be fabricated with large size. However, the warpage for wafer level 2.5D or 3D packaging using glass interposer is a serious issue. This paper studies the warpage caused by thermal mismatch in the packaging process using different modulus and coefficient of thermal expansion(CTE) epoxy resin materials, and explores whether the chip distribution has an effect on the warpage and the change law.The pattern of wafer warpage is explored by controlling a single variable, changing the position of the chip patch and using different CTEs of epoxy resin materials.