2x-Thru De-embedding Uncertainty for On-Package High-Speed Interconnects
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)(2022)
摘要
With the ever-increasing data rates, interconnect performance predictability becomes more and more challenging. Therefore, along with an accurate methodology, the quantification of measurement reproducibility and its impacts are essential in almost all aspects of high-speed interconnect validation. This paper investigates the reproducibility of S-parameter measurements before and after 2x-Thru de-embedding, and illustrates a multimetric correlation with uncertainty analysis.
更多查看译文
关键词
de-embedding,measurement uncertainty,reproducibility,correlation,high-speed interconnects
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要