A defect localization method based on self-sensing and orthogonal matching pursuit

Yuqing Gao,Weilei Mu,Fuh-Gwo Yuan,Guijie Liu

Ultrasonics（2023）

引用 1|浏览18

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摘要

•Using self-sensing wafers in non-destructive testing.•Separating wave packets acutely overlapped.•A matching strategy to determine the matching relationship between wave packets and wave paths.•Only one self-sensing wafer can localize one or two defects.

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关键词

Self-sensing,Wave packets decomposition,Defect localization

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