2-D Array Design and Fabrication With Pitch-Shifting Interposer at Frequencies From 4 MHz up to 10 MHz
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control(2022)
摘要
High element density and strict constraints of the element’s size have significantly limited the design and fabrication of 2-D ultrasonic arrays, especially fully sampled 2-D arrays. Recently, 3-D printing technology has been one of the most rapidly developing fields. Along with the great progress of 3-D printing technology, complex and detailed 3-D structures have become readily available with a short iteration cycle, which allows us to reduce the complexity of routing and helps to ameliorate assembly problems in 2-D ultrasound array fabrication. In this work, we designed and fabricated 2-D ultrasound arrays for an array of applications with a pitch-shifting interposer, which allowed us to fit different array designs with the same circuit design and significantly reduce the requirements in routing and connection for 2-D array fabrication at frequencies from 4 to 10 MHz. Results demonstrated that this design would make 2-D arrays more available and affordable.
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关键词
Transducers,Ultrasonography,Equipment Design
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