Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level

IEEE Transactions on Components, Packaging and Manufacturing Technology(2022)

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摘要
Universal Chiplet Interconnect Express (UCIe) is an open industry standard interconnect for developing an open chiplet ecosystem, where chiplets from any supplier can be packaged anywhere in an interoperable manner. This article delves into the architectural, circuit, channel, and packaging aspects that we developed that has been adopted in the UCIe 1.0 Specification. We present our results based on our channel and circuit implementation studies.
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关键词
Accelerator,availability,chiplet,compute express link,co-packaged optics,memory expansion,packaging,Peripheral Component Interconnect (PCI) Express,pooling,power-efficiency,rack scale architecture,reliability
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