A Pitch-Matched Transceiver ASIC With Shared Hybrid Beamforming ADC for High-Frame-Rate 3-D Intracardiac Echocardiography

IEEE Journal of Solid-State Circuits(2022)

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摘要
In this article, an application-specific integrated circuit (ASIC) for 3-D, high-frame-rate ultrasound imaging probes is presented. The design is the first to combine element-level, high-voltage (HV) transmitters and analog front-ends, subarray beamforming, and in-probe digitization in a scalable fashion for catheter-based probes. The integration challenge is met by a hybrid analog-to-digital converter (ADC), combining an efficient charge-sharing successive approximation register (SAR) first stage and a compact single-slope (SS) second stage. Application in large ultrasound imaging arrays is facilitated by directly interfacing the ADC with a charge-domain subarray beamformer, locally calibrating interstage gain errors and generating the SAR reference using a power-efficient local reference generator. Additional hardware-sharing between neighboring channels ultimately leads to the lowest reported area and power consumption across miniature ultrasound probe ADCs. A pitch-matched design is further enabled by an efficient split between the core circuitry and a periphery block, the latter including a datalink performing clock data recovery (CDR) and time-division multiplexing (TDM), which leads to a 12-fold total channel count reduction. A prototype of $8{\times }9$ elements was fabricated in a TSMC 0.18- $\mu \text{m}$ HV BCD technology and a 2-D PZT transducer matrix with a pitch of $160 \mu \text{m}$ , and a center frequency of 6 MHz was manufactured on the chip. The imaging device operates at up to 1000 volumes/s, generates 65-V transmit pulses, and has a receive power consumption of only 1.23 mW/element. The functionality has been demonstrated electrically as well as in acoustic and imaging experiments.
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关键词
3-D ultrasound,high-frame-rate,high-voltage (HV) transmitter,hybrid analog-to-digital converter (ADC),intracardiac echocardiography (ICE),subarray beamforming,successive approximation register (SAR)/single-slope (SS) ADC,ultrasound application-specific integrated circuit (ASIC)
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